doc. no : qw0905-la38b-66/g rev. : a date : 03 - mar - 2005 data sheet led arra y ligitek electronics co.,ltd. property of ligitek only la38b-66/g
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg2041 part no. la38b-66/g package dimensions page 1/4 ligitek electronics co.,ltd. property of ligitek only 5.2 4.0 1.0min 25.0min 0.5 typ 2.54typ 1.5max 4.2 3.0 - + + - 3.0 4.0 4.2 5.2 9.2? 0.5 4.0 4.0 ?? 0.5 typ. 1.0min.
tstg storage temperature -40 ~ +100 max 260 j for 5 sec max (2mm from body) forward voltage @20ma(v) 1.7 min. note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. typical electrical & optical characteristics (ta=25 j ) spectral halfwidth ??f nm peak wave length f pnm material part no green emitted la38b-66/g gap green transparent lens 565 30 soldering temperature color tsol viewing angle 2 c 1/2 (deg) luminous intensity @10ma(mcd) 45 typ. 2.6 30 max. min. 30 j -40 ~ +85 absolute maximum ratings ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 j forward current operating temperature reverse current @5v power dissipation peak forward current duty 1/10@10khz parameter i f t opr ir pd i fp symbol page 2/4 ma 30 10 100 120 j g a ma mw g unit part no. la38b-66/g
1.0 relative intensity@20ma 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 j 0.8 1.0 0.9 1.1 1.2 0.5 relative intensity@20ma normalize @25 j -40 60 ambient temperature( j ) 40 20 0 -20 100 80 0.0 ambient temperature( j ) 02040 -20 60 100 80 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 1.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 forward current(ma) 0.1 10 1.0 1000 g chip relative intensity normalize @20ma 1.0 0.5 4.0 forward voltage(v) 2.0 3.0 5.0 0.0 1.5 1.0 2.0 100 forward current(ma) 10 1000 fig.2 relative intensity vs. forward current 2.5 3.0 ligitek electronics co.,ltd. property of ligitek only 3.5 page 3/4 part no. la38b-66/g
thermal shock test solder resistance test high temperature high humidity test solderability test mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. operating life test reliability test: low temperature storage test high temperature storage test mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) test item test condition this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description page 4/4 reference standard part no. l38b-66/g
w l h i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s 3. 12 inner boxes / carton size : l x w x h 58.5cm x 34cm x 34cm l c/no: made in china w h 2. 8 bag / inner box size : l x w x h 33.5cm x 19cm x 7.5cm 1.500 pcs / bag packing specification part no. la38b-66/g
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